Office of Technology Transfer – University of Michigan

Compact, Modular Assembly and Packaging of Multi-Substrate Microsystems

Technology #2669

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Categories
Researchers
Khalil Najafi
Managed By
Joohee Kim
Licensing Specialist, Physical Sciences & Engineering 734.764.8202
Patent Protection
US Patent 6,958,531

Background

Packaging is one of the main components of microfabricated systems. While there has been much development regarding manufacturing of dense packages for various multi-chip module technologies, none provides the flexibility, modularity, and small size needed for a microsystem containing substrates with sensors, actuators, and circuits fabricated using different technologies. Modularity and reworkability are particularly important in multi-substrate packages typically encountered in microsystems. In particular for MEMS devices, electrical, fluid, and optical connections are needed between dice of a microsystem, which may make the manufacturing of packaging more difficult.

Technology

Researchers at the University of Michigan have developed a multi-substrate, microsystem package and a method for assembling it. The package includes a high-density flexible connector array for use in compact and multi-substrate packages containing circuits, sensors, and actuators in a re-workable and modular approach. The package is designed as a cube with highly flexible connectors providing electrical and fluidic connections between the substrates. The cables are integrated in the inside walls of the cube and make pressure contacts to the pads on stacked substrates. The cables are designed to be flexible and capable of being manipulated so that individual dice can be inserted to populate the cube. These flexible cables can be made out of Parylene or any other suitable polymer, metal or inorganic dielectrics.

Applications and Advantages

Applications

  • packaging for microsystems

Advantages

  • compact and multi-substrate packages containing-nl-circuits, sensors, and actuators
  • re-workable and modular