Polymeric elastomers such as poly(dimethylsiloxane) are widely used as materials for bioMEMS and have driven the need for appropriate bonding technologies for its fabrication. Currently available bonding methods include oxygen plasma or UV/ozone treatment, which can typically be used only on certain materials. New bonding processes that are more robust and can be applied to various substrates are needed.
This invention describes a new bonding process for dry adhesion of various substrates based on chemical vapor deposition (CVD) polymerization. First, an adhesion layer containing reactive groups is deposited onto a substrate in a solvent-less process. As the reactive groups in this layer can react with another functional group, this procedure can be used to bond together two substrates or different components to a single substrate. This approach results in a more flexible and robust bonding process that can be applied to a variety of substrates.
Applications and Advantages
- Microelectomechanical systems (MEMS)/-nl-bioMEMS
- Elastomeric microanalytical systems
- Approach applicable to a variety-nl-of substrates
- Does not exhibit hydrophobic recovery-nl-behavior