Office of Technology Transfer – University of Michigan

Scalable Fabrication of Multidimensional Nanopatterns via Sequential Combination of Continuous One-Dimensional Nanopatterning Strokes

Technology #6790

Questions about this technology? Ask a Technology Manager

Download Printable PDF

Categories
Researchers
Jong G. Ok
Managed By
Joohee Kim
Licensing Specialist, Physical Sciences & Engineering 734.764.8202
Patent Protection
US Patent Pending
Publications
Continuous fabrication of scalable 2-dimensional (2D) micro- and nanostructures by sequential 1D mechanical patterning processes
Nanoscale Issue 24, 2014, 2014

Two-dimensional (2D) nanopatterning has seen momentum over the past decade in various thin-film applications (such as antireflection coatings, bioengineering templates, plasmonic surfaces, and photovoltaics). 2D nanostructures can currently be made using various techniques but the major hurdle for widespread adoption is scalability. The disclosed technology offers a solution to the scalability problem and may become the enabling step towards new nanopattern-based applications. The nanotools market is $5.3B in 2014 and is projected to be $11.3B in 2019 with a CAGR of 16.2%.

How it works

The disclosed technology is based on recent developments of two mechanical nanopatterning techniques: Dynamic Nano-Inscribing (DNI) and Vibrational Indentation Patterning (VIP). With DNI, the sharp edge of a Si mold (such as a ruled grating) is pressed into a moving, softer substrate at a slight angle, inscribing a pattern. VIP uses the tilted edge of a hard material that is vibrating at a high frequency while the substrate is moving, creating periodic indentation patterns at high speed. The disclosed technology is a unique combination of DNI and VIP that offers continuous and scalable 2D nano/micropatterning and has been demonstrated successfully to fabricate nanostructures used to trap and confine nanoparticles.

Applications

  • Semiconductor nanostructures
  • Bioengineering solutions
  • Photonics

Advantages

  • Scalable
  • Simplified process compared to competing technologies (such as UV lithography)
  • High-Throughput
  • Can be done in air